ISO 9453:2020

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Soft solder alloys - Chemical compositions and forms

standard by International Organization for Standardization , 09/01/2020

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Full Description

ISO 9453:2020 specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

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Document History

  1. ISO 9453:2020

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    Soft solder alloys - Chemical compositions and forms

    • Most Recent

  2. ISO 9453:2014


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  3. ISO 9453:2006


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  4. ISO 9453:1990


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

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Product Details

Edition:

4th

Published:

09/01/2020

Number of Pages:

20

Same As:

BS EN ISO 9453:2020, DIN EN ISO 9453