BS 2011-2.1TA:1989 Historical

1100725

Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method

standard by BSI Group , 04/28/1989

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Full Description

Determinaton of the solderability of component terminations of any shape. Suitable for reference testing and for components that cannot be quantitatively tested by other methods. To be read in conjunction with BS 2011:Part 1.1

Cross References: BS 2011:Part 2.1T* See more

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Document History

  1. BS EN 60068-2-69:2017+A1:2019


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Most Recent

  2. BS EN 60068-2-69:2017


    Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version

  3. BS EN 60068-2-69:2007


    Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  4. BS EN 60068-2-54:2006


    Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  5. BS EN 60068-2-69:1996


    Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version

  6. BS 2011-2.1TA:1989

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    Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method

    • Historical Version

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Product Details

Published:

04/28/1989

ISBN(s):

0580391329

Number of Pages:

14

File Size:

1 file

Product Code(s):

194382, 194382, 194382

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus