BS 5909:1980 ✓ Most Recent

1104434

Method for scale adhesion test for oxygen-free copper

standard by BSI Group , 04/30/1980

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Full Description

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide. See more

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Price: $170.18
Available for Immediate Download

Product Details

Published:

04/30/1980

ISBN(s):

0580112659

Number of Pages:

2

File Size:

1 file

Product Code(s):

27795, 27795, 27795

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus