BS EN 61190-1-2:2014 ✓ Most Recent

1879014 Preview

Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

standard by British-Adopted European Standard , 06/30/2014

Track This

Full Description



Cross References:
IEC 60194
IEC 61189-5-3
IEC 61190-1-1
IEC 61190-1-3
ISO 9454-2
EN 60194
EN 61189-5-3
EN 61190-1-3
EN ISO 9454-2
IEC 61189-5:2006
IEC 61189-6:2006
EN 61189-5:2006
EN 61189-6:2006
IPC-HDBK-005


All current amendments available at time of purchase are included with the purchase of this document. See more

Also Bought By Customers

 

Document History

  1. BS EN 61190-1-2:2014

    👀 currently
    viewing


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Most Recent

  2. BS EN 61190-1-2:2007


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  3. BS 05/30133283 DC


    IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

    • Historical Version

  4. BS EN 61190-1-2:2002


    Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly

    • Historical Version

Order Options

Delivery Options
Price: $279.40
Available for Immediate Download

Product Details

Published:

06/30/2014

ISBN(s):

9780580778407

Number of Pages:

26

File Size:

1 file

Product Code(s):

30258439, 30258439, 30258439

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus