BS EN IEC 60068‑2‑83:2025 ✓ Most Recent

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Environmental testing - Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

standard by British-Adopted European Standard , 07/31/2025

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Full Description

This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste.

Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.

NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.

All current amendments available at time of purchase are included with the purchase of this document. See more

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  1. BS EN IEC 60068‑2‑83:2025

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    Environmental testing - Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

    • Most Recent

  2. BS EN 60068-2-83:2011


    Environmental testing-Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

    • Historical Version

  3. BS 07/30165180 DC


    BS EN 60068-2-83. Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste

    • Historical Version

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Product Details

Published:

07/31/2025

ISBN(s):

9780539288933

Number of Pages:

42

File Size:

1 file

Product Code(s):

30480993, 30480993, 30480993

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This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus