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  1. Home
  2. BS EN IEC 61190-1-3:2018

BS EN IEC 61190-1-3:2018 ✓ Most Recent

2009716  Preview

Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

standard by British-Adopted European Standard , 03/28/2018

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Full Description

BS EN IEC 61190-1-3:2018 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.


Cross References:
IEC 61189-5-3:2015
IEC 61189-5-2:2015
IEC 61190-1-1:2002
EN 61190-1-1 (IEC 61190-1-1:2002 AS)
IEC 60194:2015
EN 61189-5-4 (IEC 61189-5-4:2015) AS
IEC 61189-5-4:2015
EN 61189-5-2 (IEC 61189-5-2:2015) AS
IEC 61190-1-2
EN 61190-1-2
EN 61189-5-3 (IEC 61189-5-3:2015) AS
IEC 61189-5
EN ISO 9453
ISO 9454-2
IEC 61189-6
EN 61189-5
EN 61189-6
ISO 9453
EN ISO 9454-1
ISO 9454-1
EN ISO 9454-2
ISO 1073-1


All current amendments available at time of purchase are included with the purchase of this document.
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Document History

  1. BS EN IEC 61190-1-3:2018

    You are currently viewing this product 👀 currently
    viewing

    March 2018
    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Most Recent  Most Recent
  2. BS EN 61190-1-3:2007+A1:2010

    March 2011
    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version
  3. BS EN 61190-1-3:2007

    July 2007
    Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version
  4. BS 05/30133287 DC

    May 2005
    IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    • Historical Version
  5. BS EN 61190-1-3:2002

    August 2002
    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    • Historical Version

Browse related products from British-Adopted European Standard

  • BSI Group > 31:ELECTRONICS > 31.190: Electronic component assemblies

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Price: $368.30
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Product Details

Published:

03/28/2018

ISBN(s):

9780580892387

Number of Pages:

48

File Size:

1 file , 1.4 MB

Product Code(s):

30318682, 30318682, 30318682

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