IEC 60286-3 Ed. 7.0 b:2022 ✓ Most Recent

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Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

standard by International Electrotechnical Commission , 11/01/2022

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Full Description

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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Document History

  1. IEC 60286-3 Ed. 7.0 b:2022

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    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    • Most Recent

  2. IEC 60286-3 Ed. 6.0 b:2019


    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    • Historical Version

  3. IEC 60286-3 Ed. 5.0 b:2013


    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    • Historical Version

  4. IEC 60286-3 Ed. 4.0 b:2007


    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    • Historical Version

  5. IEC 60286-3 Ed. 4.0 en:2007


    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

    • Historical Version

  6. IEC 60286-3 Ed. 3.0 b:1997


    Packging of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes

    • Historical Version

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Product Details

Edition:

7.0

Published:

11/01/2022

ISBN(s):

9782832258996

Number of Pages:

84

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus