IPC 2226 Historical

1095079

Sectional Design Standard for High Density Interconnect (HDI) Boards

standard by IPC by Global Electronics Association , 05/01/2003

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Full Description

Designers and manufacturers looking for the next level of guidance on building high density interconnect (HDI) boards will welcome IPC-2226. Used in conjunction with IPC-2221, this standard establishes requirements and considerations for high density interconnect (HDI) printed board design and its forms of component mounting and interconnecting structures. Based on years of industry manufacturing and design experience, the standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses required to match the mounting structure to the selected chip set are included. See more

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Document History

  1. IPC 2226A


    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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  2. IPC 2226

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    Sectional Design Standard for High Density Interconnect (HDI) Boards

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Price: $135.00
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Product Details

Published:

05/01/2003

Number of Pages:

49

File Size:

1 file

Product Code(s):

2226(D)1, 2226(D)1

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus