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Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

standard by IPC by Global Electronics Association , 07/27/2021

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Full Description

IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.

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Document History

  1. IPC 4552B

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    viewing


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Most Recent

  2. IPC 4552A


    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Historical Version

  3. IPC 4552-WAM1-2


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2

    • Historical Version

  4. IPC 4552


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2

    • Historical Version

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Price: $225.00
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Product Details

Published:

07/27/2021

ISBN(s):

9781638160151

Number of Pages:

156

File Size:

1 file

Product Code(s):

4552-STD-0-D-0-EN-B, 4552-STD-0-D-0-CN-B, 4552-STD-0-D-0-EN-B, 4552-STD-0-D-0-CN-B

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus