IPC 6018D ✓ Most Recent

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Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

standard by IPC by Global Electronics Association , 02/01/2022

Amendments Available

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Full Description

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. 

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

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Document History

  1. IPC 6018D

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    viewing


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Most Recent

  2. IPC 6018C


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Historical Version

  3. IPC 6018B


    Microwave End Product Board Inspection and Test

    • Historical Version

  4. IPC 6018A


    Microwave End Product Board Inspection and Test

    • Historical Version

  5. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IPC 6018DS


    Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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Price: $190.00
Available for Immediate Download

Product Details

Published:

02/01/2022

ISBN(s):

9781638160601

Number of Pages:

60

File Size:

1 file

Product Code(s):

6018-STD-0-D-0-EN-D

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus