IPC 6801 ✓ Most Recent

1589025

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards

standard by IPC by Global Electronics Association , 01/01/2000

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Full Description

Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs. See more

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Price: $135.00
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Product Details

Edition:

1st

Published:

01/01/2000

ISBN(s):

1580982395

Number of Pages:

41

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus