IPC 7091A ✓ Most Recent

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Design and Assembly Process Implementation of 3D Components

standard by IPC by Global Electronics Association , 01/01/2023

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Full Description

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.

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    Design and Assembly Process Implementation of 3D Components

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Product Details

Published:

01/01/2023

ISBN(s):

9781638161134

Number of Pages:

104

File Size:

1 file

Product Code(s):

7091-STD-0-D-0-JP-A, 7091-STD-0-P-0-JP-A

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus