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Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

standard by IPC by Global Electronics Association , 08/01/2024

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Full Description

This document describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, rework and reliability issues associated with design and assembly of printed boards using these packages.

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Document History

  1. IPC 7095E

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    Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)

    • Most Recent

  2. IPC 7095D-WAM1


    Design and Assembly Process Implementation for BGAs, Includes Amendment 1

    • Historical Version

  3. IPC 7095D


    Design and Assembly Process Implementation for BGAs

    • Historical Version

  4. IPC 7095C


    Design and Assembly Process Implementation for BGAs

    • Historical Version

  5. IPC 7095B


    Design and Assembly Process Implementation for BGAs

    • Historical Version

  6. IPC 7095A


    Design and Assembly Process Implementation for BGAs

    • Historical Version

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Price: $183.00
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Product Details

Published:

08/01/2024

ISBN(s):

9781638161790

Number of Pages:

208

File Size:

1 file

Product Code(s):

7095-STD-0-D-0-EN-E, 7095-STD-0-D-0-EN-E

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus