IPC 7530 Historical

914735

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

standard by IPC by Global Electronics Association , 06/01/2001

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Full Description

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for the construction of appropriate profiling test vechicles and various techniques and methodologies for temperature profiling. See more

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Document History

  1. IPC 7530B


    Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

    • Most Recent

  2. IPC 7530A


    Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

    • Historical Version

  3. IPC 7530

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    Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

    • Historical Version

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Product Details

Published:

06/01/2001

Number of Pages:

24

File Size:

1 file

Product Code(s):

7530(D)1

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus