IPC 9702-WAM1 ✓ Most Recent

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Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1

standard by IPC by Global Electronics Association , 05/01/2015

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Full Description

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links. See more

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  1. IPC 9702-WAM1

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    Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1

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  2. IPC 9702


    Monotonic Bend Characterization of Board-Level Interconnects

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Price: $101.00
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Product Details

Published:

05/01/2015

ISBN(s):

9781611931914

Number of Pages:

28

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus