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  1. Home
  2. IPC J-STD-006A

IPC J-STD-006A Historical

914736

Requirements for Electronic Grade Solder Alloys & Fluxed & Non-Fluxed Solid Solders for Electronic Soildering Applications

standard by IPC by Global Electronics Association , 05/01/2001

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Full Description

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for "special" electronic grade solders. The most prominent change introduced by Revision A is a new alloy nomenclature system. Supercedes QQ-S-571 See more

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Document History

  1. IPC J-STD-006C

    July 2013
    Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

    • Most Recent  Most Recent
  2. IPC J-STD-006B

    January 2006
    Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

    • Historical Version
  3. IPC J-STD-006A

    You are currently viewing this product 👀 currently
    viewing

    May 2001
    Requirements for Electronic Grade Solder Alloys & Fluxed & Non-Fluxed Solid Solders for Electronic Soildering Applications

    • Historical Version
  4. IPC J-STD-006

    January 1995
    Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

    • Historical Version

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Product Details

Published:

05/01/2001

Number of Pages:

18
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