IPC J-STD-012 ✓ Most Recent

17280

Implementation of Flip Chip and Chip Scale Technology

standard by IPC by Global Electronics Association , 01/01/1996

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Full Description

This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data. Chip packaging variations include flip chip, HDI, micro BGA, micro SMT and SLICC. Also provides general information on implementing flip chip and chip scale technologies for creating multichip modules, I/C cards, memory cards and very dense surface mount assemblies. Co- developed by IPC, EIA, MCNC and Sematech. See more

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Price: $182.00
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Product Details

Published:

01/01/1996

Number of Pages:

105

File Size:

1 file

Product Code(s):

J-012(D)1

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus