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  1. Home
  2. IPC L-108B

IPC L-108B Historical [ Withdrawn ]

16766

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

standard by IPC by Global Electronics Association , 06/01/1990

This document has been replaced. View the most recent version.

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Document History

  1. IPC 4101E-WAM1

    April 2020
    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Most Recent  Most Recent
  2. IPC 4101E

    July 2015
    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  3. IPC 4101D-WAM1

    July 2015
    Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1

    • Historical Version
  4. IPC 4101D

    April 2014
    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  5. IPC 4101C

    August 2009
    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  6. IPC 4101B

    June 2006
    Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

    • Historical Version
  7. IPC 4101A

    June 2002
    Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)

    • Historical Version
  8. IPC 4101

    December 1997
    Specifications for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  9. IPC L-108B

    You are currently viewing this product 👀 currently
    viewing

    June 1990
    Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

    • Historical Version

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Product Details

Published:

06/01/1990

Number of Pages:

18

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus
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