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An Introduction to Tape Automated Bonding Fine Pitch Technology

standard by IPC by Global Electronics Association , 01/01/1989

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Full Description

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. See more

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Price: $88.00
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Product Details

Published:

01/01/1989

Number of Pages:

54

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus