IPC T-50G Historical

1221107

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

standard by IPC by Global Electronics Association , 12/01/2003

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Full Description

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching. See more

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Document History

  1. IPC T-50N


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Most Recent

  2. IPC T-50M


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  3. IPC T-50K


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  4. IPC T-50J


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  5. IPC T-50H


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  6. IPC T-50G

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    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

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Price: $97.00
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Product Details

Published:

12/01/2003

Number of Pages:

135

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus