IPC TR-486 ✓ Most Recent

926795

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

standard by IPC by Global Electronics Association , 07/01/2001

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Full Description

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. See more

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Price: $142.00
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Product Details

Published:

07/01/2001

Number of Pages:

56

File Size:

1 file

Product Code(s):

TR-486(D)1, TR-486(D)1

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus