ISO 9453:2006 Historical

1286377

Soft solder alloys - Chemical compositions and forms

standard by International Organization for Standardization , 10/01/2006

This item is not available for sale.

Track This

Identical Versions Available

Full Description

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

See more

Also Bought By Customers

 

Document History

  1. ISO 9453:2020


    Soft solder alloys - Chemical compositions and forms

    • Most Recent

  2. ISO 9453:2014


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  3. ISO 9453:2006

    👀 currently
    viewing


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  4. ISO 9453:1990


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

Order Options

Unavailable

Product Details

Published:

10/01/2006

Same As:

BS EN ISO 9453:2006