SD-95-04-1 -- COOLP: A Computer Program for the Design and Analysis of Ceiling Cooling Panels ✓ Most Recent

The success of a panel cooling system largely depends on careful analysis of anticipated indoor conditions and proper design. Cooling performance of the panel and its surface temperature distribution at various indoor and outdoor conditions must be simulated in order to assure proper functioning without surface condensation. This makes it essential to develop software to manipulate all the relevant design variables, retaining sufficient simplicity so that the program will be welcomed by designers. Using a quasi-steady-state heat transfer model, a computer program was developed in order to provide a design and analysis tool for ceiling cooling panels. For an optimal design, the algorithm enforces 16 constraints, including a temperature check against surface condensation. The current version includes both in-slab applications and attached tubing, such as suspended metal cooling panels. Panel material and its configuration are program inputs as well as the sensible cooling load. Cooling fluid may be specified as any proportion of water and antifreeze mixture. A universal design nomograph for ceiling and floor cooling was also generated using this computer program. Reviews the literature and explains the computer program with a case study for metal ceiling cooling panels. Also revealed is the importance of some hydronic parameters, and the conflict among the tube Reynolds number, tube spacing, and the circuit pressure drop for a given cooling load is underlined.

KEYWORDS: year 1995, cooling load, computer programs, designing, ceiling cooling, panel cooling, ceilings, algorithms, reviews, condensation, surfaces, heat flow, case studies