IPC A-610F-WAM1 Historical

IPC-A-610F with Amendment 1 incorporates the requirements of IPC-A-610F and IPC-A-610F Amendment 1 into one document. Criteria are presented in a seamless IPC-A-610 format, and there are no redline marks. This document is the equivalent to using IPC-A-610F and IPC-A-610F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to update their documentation with the latest available format.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding - all without eleminating any requirements.

Major topics include:

• flex attachment,
• board-in-board,
• part-on-part,
• both lead-free and tin-lead criteria,
• component orientation and soldering criteria for through hole,
• SMT,
• cleaning, marking, coating and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria - 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001. See more