IEC 60191-6-12 Ed. 1.0 en:2002 Historical [ Withdrawn ]

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Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

standard by International Electrotechnical Commission , 06/14/2002

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Full Description

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular. See more

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Document History

  1. IEC 60191-6-12 Ed. 2.0 b:2011


    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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  2. IEC 60191-6-12 Ed. 1.0 en:2002

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    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

    • Historical Version

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Price: $100.00
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Product Details

Edition:

1.0

Published:

06/14/2002

Number of Pages:

20

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus