31.080: Semiconductor devices

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  1. MOST RECENT

    IEC 60050-521 Amd.1 Ed. 2.0 b:2017▹

    Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits

    Amendment by International Electrotechnical Commission, 08/30/2017.

    Languages: English,French

    Priced From:

  2. MOST RECENT

    IEC 60050-521 Ed. 2.0 b:2002▹

    International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits

    standard by International Electrotechnical Commission, 05/22/2002.

    Languages: English,French

    Amendments, rulings, and supplements: IEC 60050-521 Amd.2 Ed. 2.0 b:2018, IEC 60050-521 Amd.1 Ed. 2.0 b:2017

    Priced From:

  3. MOST RECENT

    IEC 60134 Ed. 1.0 b:1961▹

    Rating systems for electronic tubes and valves and analogous semiconductor devices

    standard by International Electrotechnical Commission, 01/01/1961.

    Languages: English,French

    Priced From:

  4. MOST RECENT

    IEC 60191-4 Amd.2 Ed. 2.0 b:2002▹ [ Withdrawn ]

    Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

    Amendment by International Electrotechnical Commission, 07/17/2002.

    Languages: English,French

    Priced From:

  5. MOST RECENT

    IEC 60191-4 Ed. 2.2 b:2002▹ [ Withdrawn ]

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

    standard by International Electrotechnical Commission, 10/22/2002.

    Languages: English,French

    Priced From:

  6. HISTORICAL

    IEC 60191-4 Ed. 3.0 b:2013▹

    This document has been replaced. View the most recent version.

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

    standard by International Electrotechnical Commission, 10/10/2013.

    Languages: English,French

    Amendments, rulings, and supplements: IEC 60191-4 Amd.1 Ed. 3.0 b:2018

    Historical Editions: IEC 60191-4 Ed. 3.1 b:2018

    Priced From:

  7. MOST RECENT

    IEC 60191-5 Ed. 2.0 b:1997▹

    Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

    standard by International Electrotechnical Commission, 04/23/1997.

    Languages: English,French

    Priced From:

  8. MOST RECENT

    IEC 60747-1 Amd.1 Ed. 2.0 b:2010▹

    Amendment 1 - Semiconductor devices - Part 1: General

    Amendment by International Electrotechnical Commission, 05/19/2010.

    Languages: English,French

    Priced From:

  9. MOST RECENT

    IEC 60747-1 Amd.3 Ed. 1.0 b:1996▹ [ Withdrawn ]

    Amendment 3 - Semiconductor devices - Discrete devices - Part 1: General

    Amendment by International Electrotechnical Commission, 09/26/1996.

    Languages: English,French

    Priced From:

  10. HISTORICAL

    IEC 60747-1 Ed. 1.0 b:1983▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Semiconductor devices - Discrete devices - Part 1: General

    standard by International Electrotechnical Commission, 01/01/1983.

    Languages: English,French

    Amendments, rulings, and supplements: IEC 60747-1 Amd.3 Ed. 1.0 b:1996

    Historical Editions: IEC 60747-1 Ed. 2.0 en:2006

    Priced From: