IEC 60191-6-13 Ed. 1.0 en:2007 Historical

1509768

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

standard by International Electrotechnical Commission , 06/27/2007

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Full Description

This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA. See more

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Document History

  1. IEC 60191-6-13 Ed. 2.0 b:2016


    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

    • Most Recent

  2. IEC 60191-6-13 Ed. 1.0 b:2007


    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

    • Historical Version

  3. IEC 60191-6-13 Ed. 1.0 en:2007

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    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

    • Historical Version

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Product Details

Edition:

1.0

Published:

06/27/2007

Number of Pages:

15

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus