IEC 60191-6-18 Ed. 1.0 b:2010 ✓ Most Recent

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Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

standard by International Electrotechnical Commission , 01/07/2010

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Full Description

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. See more

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Document History

  1. IEC 60191-6-18 Ed. 1.0 b:2010

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    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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  2. IEC/PAS 60191-6-18 Ed. 1.0 en:2008


    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

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    Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

  2. IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

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    Download


    Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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Product Details

Edition:

1.0

Published:

01/07/2010

Number of Pages:

40

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus