IEC 60749-3 Ed. 2.0 b:2017 ✓ Most Recent

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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

standard by International Electrotechnical Commission , 03/03/2017

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Full Description

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

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Document History

  1. IEC 60749-3 Ed. 2.0 b:2017

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    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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  2. IEC 60749-3 Ed. 2.0 en:2017


    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

    • Historical Version

  3. IEC 60749-3 Ed. 1.0 b CORR1:2003


    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

    • Historical Version

  4. IEC 60749-3 Ed. 1.0 b:2002


    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

    • Historical Version

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Product Details

Edition:

2.0

Published:

03/03/2017

Number of Pages:

21

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus