IPC 9631 ✓ Most Recent

1759066

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

standard by IPC by Global Electronics Association , 12/01/2010

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Full Description

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment. See more

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Product Details

Published:

12/01/2010

Number of Pages:

24

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus