Referenced Documents for document BS EN 61190-1-2:2002

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  1. MOST RECENT

    BS EN 61190-1-1:2002▹

    Attachment materials for electronic assembly-Requirements for soldering fluxes for high-quality interconnections in electronics assembly

    standard by British-Adopted European Standard, 08/16/2002.

    Languages: English

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  2. HISTORICAL

    BS EN 61190-1-3:2002▹

    This document has been replaced. View the most recent version.

    Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    standard by British-Adopted European Standard, 08/12/2002.

    Languages: English

    Historical Editions: BS EN IEC 61190-1-3:2018, BS EN 61190-1-3:2007+A1:2010, BS EN 61190-1-3:2007, BS 05/30133287 DC

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  3. HISTORICAL

    BS EN ISO 9002:1994▹

    This document has been replaced. View the most recent version.

    Quality systems. Model for quality assurance in production, installation and servicing

    standard by British Standard / European Standard / International Organization for Standardization, 07/15/1994.

    Languages: English

    Historical Editions: BS EN ISO 9001:2015 LOOSELEAF, BS EN ISO 9001:2008, BS EN ISO 9001:2000, BS EN ISO 9001:1994, BS EN ISO 9003:1994, BS 5750-1:1987, BS 5750-3:1987, BS 5750-2:1987, BS 5750-1:1979, BS 5750-3:1979, BS 5750-2:1979

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  4. MOST RECENT

    IEC 61190-1-1 Ed. 1.0 b:2002▹

    Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

    standard by International Electrotechnical Commission, 03/25/2002.

    Languages: English,French

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  5. HISTORICAL

    ISO 9001:2000▹

    This document has been replaced. View the most recent version.

    Quality management systems -- Requirements

    standard by International Organization for Standardization, 12/15/2000 in Spanish, English.

    Languages: English,Spanish

    Historical Editions: ISO 9001:2015 Plus Redline, ISO 9001:2015[F], ISO 9001:2015, ISO/FDIS 9001-2015 Final Draft, ISO/DIS 9001-2015 Draft, ISO 9001:2008[F], ISO 9001:2008, ISO 9000 / 9001 SET, ISO 9001:1994, ISO 9003:1994, ISO 9002:1994, ISO 9001:1987

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  6. HISTORICAL

    ISO 9453:1990▹

    This document has been replaced. View the most recent version.

    Soft solder alloys - Chemical compositions and forms

    standard by International Organization for Standardization, 12/01/1990.

    Languages: English

    Historical Editions: ISO 9453:2020, ISO 9453:2014, ISO 9453:2006

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  7. HISTORICAL

    ISO 9454-2:1998▹

    This document has been replaced. View the most recent version.

    Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements

    standard by International Organization for Standardization, 08/01/1998.

    Languages: English

    Historical Editions: ISO 9454-2:2020

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  8. HISTORICAL

    IEC 61190-1-3 Ed. 1.0 b:2002▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    standard by International Electrotechnical Commission, 03/22/2002.

    Languages: English,French

    Historical Editions: IEC 61190-1-3 Ed. 2.0 en:2007, IEC 61190-1-3 Ed. 2.0 b:2007

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  9. HISTORICAL

    IEC 61191-1 Ed. 1.0 b:1998▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    standard by International Electrotechnical Commission, 08/28/1998.

    Languages: English,French

    Historical Editions: IEC 61191-1 Ed. 3.0 b:2018, IEC 61191-1 Ed. 2.0 b:2013

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  10. HISTORICAL

    IEC 61191-2 Ed. 1.0 b:1998▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

    standard by International Electrotechnical Commission, 08/28/1998.

    Languages: English,French

    Historical Editions: IEC 61191-2 Ed. 3.0 en:2017, IEC 61191-2 Ed. 3.0 b:2017, IEC 61191-2 Ed. 2.0 b:2013

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