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Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

standard by IPC by Global Electronics Association , 01/01/2025

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Full Description

This document describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering. 

Thermal profile is a unique temperature vs. time plot for each fully populated printed board assembly, using thermocouples attached to selected representative components of the printed board assembly as it travels at a given belt speed (i.e., transport speed) through various temperature zones of an oven or soldering system.

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  1. IPC 7530B

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    Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

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    Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

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    Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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Price: $190.00
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Product Details

Published:

01/01/2025

ISBN(s):

9781638162032

Number of Pages:

52

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus