IEC 60191-4 Ed. 3.0 b:2013 Historical

1867213

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

standard by International Electrotechnical Commission , 10/10/2013

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Full Description

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. See more

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Document History

  1. IEC 60191-4 Ed. 3.1 b:2018


    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

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    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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Amendments, rulings, supplements, and errata

  1. IEC 60191-4 Amd.1 Ed. 3.0 b:2018


    Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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Product Details

Edition:

3.0

Published:

10/10/2013

Number of Pages:

48

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus