IEC 60191-4 Ed. 3.1 b:2018 ✓ Most Recent

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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

standard by International Electrotechnical Commission , 03/27/2018

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IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication. See more

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  1. IEC 60191-4 Ed. 3.1 b:2018

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    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION

    • Most Recent

  2. IEC 60191-4 Ed. 3.0 b:2013


    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

    • Historical Version

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Product Details

Edition:

3.1

Published:

03/27/2018

Number of Pages:

152

File Size:

1 file

Note:

This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus