IPC 9701B ✓ Most Recent

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Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

standard by IPC by Global Electronics Association , 02/01/2022

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Full Description

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

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Document History

  1. IPC 9701B

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    Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

    • Most Recent

  2. IPC 9701A


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version

  3. IPC 9701


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version

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Price: $102.00
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Product Details

Published:

02/01/2022

ISBN(s):

9781638160724

Number of Pages:

24

File Size:

1 file

Product Code(s):

9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B

Note:

This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus