JC-11: Mechanical (Package Outlines) Standardization

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1. HISTORICAL

   

   JEDEC JESD30E▹

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   DESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGES

   standard by JEDEC Solid State Technology Association, 08/01/2008.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30F

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2. HISTORICAL

   

   JEDEC JESD30F▹

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   Descriptive Designation System for Semiconductor-device Packages

   standard by JEDEC Solid State Technology Association, 04/01/2013.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30E

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3. HISTORICAL

   

   JEDEC JESD30G▹

   This document has been replaced. View the most recent version.

   Descriptive Designation System for Semiconductor-device Packages

   standard by JEDEC Solid State Technology Association, 01/01/2016.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30F, JEDEC JESD30E

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4. HISTORICAL

   

   JEDEC JESD30H▹

   This document has been replaced. View the most recent version.

   Descriptive Designation System for Semiconductor-device Packages

   standard by JEDEC Solid State Technology Association, 08/01/2017.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30G, JEDEC JESD30F, JEDEC JESD30E

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5. HISTORICAL

   

   JEDEC JESD30L▹

   This document has been replaced. View the most recent version.

   Descriptive Designation System for Electronic-device Packages and Footprints

   standard by JEDEC Solid State Technology Association, 11/01/2023.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30F, JEDEC JESD30E

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6. HISTORICAL

   

   JEDEC JESD30M▹

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   Descriptive Designation System for Electronic-device Packages and Footprints

   standard by JEDEC Solid State Technology Association, 07/01/2024.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30N, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30F, JEDEC JESD30E

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7. HISTORICAL

   

   JEDEC JESD30N▹

   This document has been replaced. View the most recent version.

   Descriptive Designation System for Electronic-device Packages and Footprints

   standard by JEDEC Solid State Technology Association, 12/01/2024.

   Languages: English

   Historical Editions: JEDEC JESD30O, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30F, JEDEC JESD30E

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8. MOST RECENT

   

   JEDEC JESD30O▹

   Descriptive Designation System for Electronic-device Packages and Footprints

   standard by JEDEC Solid State Technology Association, 02/01/2025.

   Languages: English

   Historical Editions: JEDEC JESD30N, JEDEC JESD30M, JEDEC JESD30L, JEDEC JESD30H, JEDEC JESD30G, JEDEC JESD30F, JEDEC JESD30E

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JEDEC Catalog

• JC-10: Terms, Definitions, and Symbols
• JC-11: Mechanical (Package Outlines) Standardization
• JC-13: Government Liason +
  • JC-13.2: Microelectronic Devices
  • JC-13.4: Radiation Hardness: Assurance and Characterization
  • JC-13.5: Hybrid, RF/Microwave, and MCM Technology
  • JC-13: Government Liason in General
• JC-14: Quality and Reliability of Solid State Products +
  • JC-14.1: Reliability Test Methods for Packaged Devices
  • JC-14.2: Wafer-Level Reliability
  • JC-14.3: Silicon Devices Reliability Qualification and Monitoring
  • JC-14.4: Quality Processes and Methods
  • JC-14.6: Failure Analysis (Inactive)
  • JC-14.7: Gallium Arsenide Reliability and Quality Standards
  • JC-14: Quality and Reliability of Solid State Products in General
• JC-15: Thermal Characterization/Packages +
  • JC-15.1: Inactive
  • JC-15.2: Inactive
  • JC-15: Thermal Characterization/Packages in General
• JC-16: Interface Technology +
  • JC-16.2: Inactive
  • JC-16: Interface Technology in General
• JC-22: Diodes and Thyristors +
  • JC-22.1: Inactive
  • JC-22.2: Rectifiers, Zeners and Signal Diodes
  • JC-22.4: Rectifiers, Zeners and Signal Diodes
  • JC-22.5: Transient Voltage Suppressors
• JC-23: Liquid Crystal Devices (Inactive)
• JC-25: Transistors
• JC-40: Digital Logic +
  • JC-40.1: Digital Logic Families and Applications
  • JC-40.3: RDIMM Support Components
  • JC-40.4: FBDIMM Support Components
  • JC-40.5: Logic Validation and Verification
  • JC-40: Digital Logic in General
• JC-41: Linear Integrated Circuits (Inactive)
• JC-42: Solid State Memories +
  • JC-42.1: Inactive
  • JC-42.3: DRAM Memories
  • JC-42.4: Non-Volatile Memory Devices
  • JC-42.6: Low Power Memories
  • JC-42: Solid State Memories in General
• JC-44: Semicustom Integrated Circuits (Inactive)
• JC-45: DRAM Modules +
  • JC-45.1: Registered DRAM Modules
  • JC-45.4: Fully Buffered DRAM Modules
  • JC-45: DRAM Modules in General
• JC-61: Wireless Interface Network Group
• JC-64: Embedded Memory Storage and Removable Memory Cards +
  • JC-64.1: Electrical Specifications and Command Protocols
  • JC-64.2: Form, Fit and Climactic/Environmental Methodologies
  • JC-64: Embedded Memory Storage and Removable Memory Cards in General
• JC-BOD
• JC-COUN
• JC-JEDC