DoD Adopted

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  1. MOST RECENT

    IPC 2141A

    Design Guide for High-Speed Controlled Impedance Circuit Boards

    standard by IPC by Global Electronics Association, 03/01/2004.

    Languages: English

  2. MOST RECENT

    IPC 2152

    Standard for Determining Current Carrying Capacity in Printed Board Design

    standard by IPC by Global Electronics Association, 08/01/2009 in English, German.

    Languages: English,German

  3. HISTORICAL

    IPC 2221B

    This document has been replaced. View the most recent version.

    Generic Standard on Printed Board Design

    standard by IPC by Global Electronics Association, 11/01/2012 in French, Japanese, English, German.

    Languages: English,French,German,Japanese

    Historical Editions: IPC 2221CIPC 2221AIPC 2221-KIT

  4. MOST RECENT

    IPC 2221C

    Generic Standard on Printed Board Design

    standard by IPC by Global Electronics Association, 12/01/2023 in Chinese, English, Japanese.

    Languages: Chinese,English,Japanese

    Historical Editions: IPC 2221BIPC 2221AIPC 2221-KIT

  5. HISTORICAL

    IPC 2223C

    This document has been replaced. View the most recent version.

    Sectional Design Standard for Flexible Printed Boards

    standard by IPC by Global Electronics Association, 11/01/2011 in English, German.

    Languages: English,German

    Historical Editions: IPC 2223EIPC 2223DIPC 2223BIPC 2223A

  6. HISTORICAL

    IPC 2223D

    This document has been replaced. View the most recent version.

    Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

    standard by IPC by Global Electronics Association, 09/01/2016.

    Languages: English

    Historical Editions: IPC 2223EIPC 2223CIPC 2223BIPC 2223A

  7. MOST RECENT

    IPC 2223E

    Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

    standard by IPC by Global Electronics Association, 01/24/2020.

    Languages: English

    Historical Editions: IPC 2223DIPC 2223CIPC 2223BIPC 2223A

  8. MOST RECENT

    IPC 2226A

    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

    standard by IPC by Global Electronics Association, 09/01/2017 in Japanese, English.

    Languages: English,Japanese

    Historical Editions: IPC 2226

  9. MOST RECENT

    IPC 2251

    Design Guide for the Packaging of High Speed Electronic Circuits

    Handbook / Manual / Guide by IPC by Global Electronics Association, 11/01/2003.

    Languages: English

  10. MOST RECENT

    IPC 2615

    Printed Board Dimensions and Tolerances

    standard by IPC by Global Electronics Association, 07/01/2000.

    Languages: English