TC 91: Electronics assembly technology

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  1. HISTORICAL

    IEC 60068-2-54 Ed. 2.0 en:2006▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    standard by International Electrotechnical Commission, 04/27/2006.

    Languages: English

    Historical Editions: IEC 60068-2-69 Ed. 3.1 b:2019, IEC 60068-2-69 Ed. 3.0 b:2017, IEC 60068-2-69 Ed. 2.0 en:2007, IEC 60068-2-69 Ed. 2.0 b:2007, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-69 Ed. 1.0 b:1995, IEC 60068-2-54 Ed. 1.0 b:1985

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  2. MOST RECENT

    IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017▹

    Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    Amendment by International Electrotechnical Commission, 07/28/2017.

    Languages: English

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  3. HISTORICAL

    IEC 60068-2-58 Ed. 3.0 b:2004▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 07/15/2004.

    Languages: English,French

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2005

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  4. HISTORICAL

    IEC 60068-2-58 Ed. 3.0 b:2005▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 02/23/2005.

    Languages: English,French

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2004

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  5. HISTORICAL

    IEC 60068-2-58 Ed. 4.0 b:2015▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    standard by International Electrotechnical Commission, 03/27/2015.

    Languages: English,French

    Amendments, rulings, and supplements: IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017

    Historical Editions: IEC 60068-2-58 Ed. 4.1 en:2017, IEC 60068-2-58 Ed. 3.0 b:2005, IEC 60068-2-58 Ed. 3.0 b:2004

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  6. MOST RECENT

    IEC 60068-2-58 Ed. 4.1 en:2017▹

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) CONSOLIDATED EDITION

    standard by International Electrotechnical Commission, 07/28/2017.

    Languages: English

    Historical Editions: IEC 60068-2-58 Ed. 4.0 b:2015, IEC 60068-2-58 Ed. 3.0 b:2005, IEC 60068-2-58 Ed. 3.0 b:2004

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  7. MOST RECENT

    IEC 60068-2-69 Amd.1 Ed. 3.0 b:2019▹

    Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    Amendment by International Electrotechnical Commission, 06/19/2019.

    Languages: English,French

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  8. HISTORICAL

    IEC 60068-2-69 Ed. 1.0 b:1995▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

    standard by International Electrotechnical Commission, 12/08/1995.

    Languages: English,French

    Historical Editions: IEC 60068-2-69 Ed. 3.1 b:2019, IEC 60068-2-69 Ed. 3.0 b:2017, IEC 60068-2-69 Ed. 2.0 en:2007, IEC 60068-2-69 Ed. 2.0 b:2007, IEC 60068-2-54 Ed. 2.0 en:2006, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-54 Ed. 1.0 b:1985

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  9. HISTORICAL

    IEC 60068-2-69 Ed. 2.0 b:2007▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    standard by International Electrotechnical Commission, 05/09/2007.

    Languages: English,French

    Historical Editions: IEC 60068-2-69 Ed. 3.1 b:2019, IEC 60068-2-69 Ed. 3.0 b:2017, IEC 60068-2-69 Ed. 2.0 en:2007, IEC 60068-2-54 Ed. 2.0 en:2006, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-69 Ed. 1.0 b:1995, IEC 60068-2-54 Ed. 1.0 b:1985

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  10. HISTORICAL

    IEC 60068-2-69 Ed. 2.0 en:2007▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    standard by International Electrotechnical Commission, 05/09/2007.

    Languages: English

    Historical Editions: IEC 60068-2-69 Ed. 3.1 b:2019, IEC 60068-2-69 Ed. 3.0 b:2017, IEC 60068-2-69 Ed. 2.0 b:2007, IEC 60068-2-54 Ed. 2.0 en:2006, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-69 Ed. 1.0 b:1995, IEC 60068-2-54 Ed. 1.0 b:1985

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