SC 47F: Micro-electromechanical systems

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  1. MOST RECENT

    IEC 62047-10 Ed. 1.0 b:2011▹

    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

    standard by International Electrotechnical Commission, 07/26/2011.

    Languages: English,French

    Corrigenda: IEC 62047-10 Ed. 1.0 b COR.1:2012

    Priced From:

  2. MOST RECENT

    IEC 62047-11 Ed. 1.0 b:2013▹

    Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

    standard by International Electrotechnical Commission, 07/17/2013.

    Languages: English,French

    Priced From:

  3. MOST RECENT

    IEC 62047-12 Ed. 1.0 b:2011▹

    Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

    standard by International Electrotechnical Commission, 09/13/2011.

    Languages: English,French

    Priced From:

  4. MOST RECENT

    IEC 62047-13 Ed. 1.0 b:2012▹

    Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

    standard by International Electrotechnical Commission, 02/28/2012.

    Languages: English,French

    Priced From:

  5. MOST RECENT

    IEC 62047-14 Ed. 1.0 b:2012▹

    Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

    standard by International Electrotechnical Commission, 02/28/2012.

    Languages: English,French

    Priced From:

  6. MOST RECENT

    IEC 62047-15 Ed. 1.0 b:2015▹ [ Withdrawn ]

    Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

    standard by International Electrotechnical Commission, 03/05/2015.

    Languages: English,French

    Priced From:

  7. MOST RECENT

    IEC 62047-16 Ed. 1.0 b:2015▹

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

    standard by International Electrotechnical Commission, 03/05/2015.

    Languages: English,French

    Priced From:

  8. MOST RECENT

    IEC 62047-17 Ed. 1.0 b:2015▹

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

    standard by International Electrotechnical Commission, 03/05/2015.

    Languages: English,French

    Priced From:

  9. MOST RECENT

    IEC 62047-18 Ed. 1.0 b:2013▹

    Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

    standard by International Electrotechnical Commission, 07/17/2013.

    Languages: English,French

    Priced From:

  10. MOST RECENT

    IEC 62047-19 Ed. 1.0 b:2013▹

    Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

    standard by International Electrotechnical Commission, 07/17/2013.

    Languages: English,French

    Priced From: