TC 91: Electronics assembly technology

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  1. HISTORICAL

    IEC 60068-2-69 Ed. 3.0 b:2017▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    standard by International Electrotechnical Commission, 03/07/2017.

    Languages: English,French

    Amendments, rulings, and supplements: IEC 60068-2-69 Amd.1 Ed. 3.0 b:2019

    Historical Editions: IEC 60068-2-69 Ed. 3.1 b:2019, IEC 60068-2-69 Ed. 2.0 en:2007, IEC 60068-2-69 Ed. 2.0 b:2007, IEC 60068-2-54 Ed. 2.0 en:2006, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-69 Ed. 1.0 b:1995, IEC 60068-2-54 Ed. 1.0 b:1985

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  2. MOST RECENT

    IEC 60068-2-69 Ed. 3.1 b:2019▹

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION

    standard by International Electrotechnical Commission, 06/19/2019.

    Languages: English,French

    Historical Editions: IEC 60068-2-69 Ed. 3.0 b:2017, IEC 60068-2-69 Ed. 2.0 en:2007, IEC 60068-2-69 Ed. 2.0 b:2007, IEC 60068-2-54 Ed. 2.0 en:2006, IEC 60068-2-54 Ed. 2.0 b:2006, IEC 60068-2-69 Ed. 1.0 b:1995, IEC 60068-2-54 Ed. 1.0 b:1985

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  3. MOST RECENT

    IEC 60068-2-77 Ed. 1.0 b:1999▹ [ Withdrawn ]

    Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

    standard by International Electrotechnical Commission, 01/15/1999.

    Languages: English,French

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  4. HISTORICAL

    IEC 60068-2-82 Ed. 1.0 b:2007▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

    standard by International Electrotechnical Commission, 05/23/2007.

    Languages: English,French

    Corrigenda: IEC 60068-2-82 Ed. 1.0 b CORR1:2009

    Historical Editions: IEC 60068-2-82 Ed. 2.0 b:2019 Draft, IEC 60068-2-82 Ed. 2.0 b:2019, IEC 60068-2-82 Ed. 1.0 en:2007

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  5. HISTORICAL

    IEC 60068-2-82 Ed. 1.0 en:2007▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

    standard by International Electrotechnical Commission, 05/23/2007.

    Languages: English

    Historical Editions: IEC 60068-2-82 Ed. 2.0 b:2019 Draft, IEC 60068-2-82 Ed. 2.0 b:2019, IEC 60068-2-82 Ed. 1.0 b:2007

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  6. MOST RECENT

    IEC 60068-2-82 Ed. 2.0 b:2019▹

    Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

    standard by International Electrotechnical Commission, 05/14/2019.

    Languages: English,French

    Historical Editions: IEC 60068-2-82 Ed. 2.0 b:2019 Draft, IEC 60068-2-82 Ed. 1.0 en:2007, IEC 60068-2-82 Ed. 1.0 b:2007

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  7. HISTORICAL

    IEC 60068-2-82 Ed. 2.0 b:2019 Draft▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

    standard by International Electrotechnical Commission, 05/14/2019.

    Languages:

    Historical Editions: IEC 60068-2-82 Ed. 2.0 b:2019, IEC 60068-2-82 Ed. 1.0 en:2007, IEC 60068-2-82 Ed. 1.0 b:2007

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  8. HISTORICAL

    IEC 60068-2-83 Ed. 1.0 b:2011▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

    standard by International Electrotechnical Commission, 09/07/2011.

    Languages: English,French

    Historical Editions: IEC 60068-2-83 Ed. 2.0 b:2025

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  9. MOST RECENT

    IEC 60068-2-83 Ed. 2.0 b:2025▹

    Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

    standard by International Electrotechnical Commission, 05/01/2025.

    Languages: English,French

    Historical Editions: IEC 60068-2-83 Ed. 1.0 b:2011

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  10. HISTORICAL

    IEC/TR 60068-3-12 Ed. 1.0 en:2007▹

    This document has been replaced. View the most recent version.

    Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

    standard by International Electrotechnical Commission - Technical Report, 03/12/2007.

    Languages: English

    Historical Editions: IEC/TR 60068-3-12 Ed. 3.0 en:2022, IEC/TR 60068-3-12 Ed. 2.0 b:2014

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